Manufacturing Wire

Roland DGA has introduced the LO-640-F3, a 64-inch UV flatbed printer capable of handling substrates up to 9.5 inches thick across a range of materials including glass, metal, plastic, wood, and leather. The system is designed for wide-format direct-to-substrate printing applications in industrial and commercial environments. UV flatbed technology cures ink on-contact with UV light, eliminating solvent off-gassing and reducing drying time relative to conventional inkjet processes.

Getac has been recognized on CRN's Edge Computing 100 list for its rugged Copilot+ PCs designed to run AI workloads locally without reliance on cloud connectivity. The devices target deployment in defense, utilities, and field service environments where network access is intermittent or unavailable. The recognition highlights growing vendor focus on hardened edge hardware capable of handling inference and AI-assisted tasks at the point of work.

SONOFLOW CO.55 SD V3.0 is a non-contact ultrasonic flowmeter from SONOTEC designed for single-use bioprocessing applications, with particular emphasis on low-flow process development and fill-and-finish operations. The instrument features a touchscreen interface for real-time flow monitoring and on-the-spot parameter adjustment without process interruption. The V3.0 series targets pharmaceutical and biotech manufacturers running disposable fluid path systems where contamination risk from wetted sensors is a concern.

Datakit has released version 2026.2 of its CAD translation and interoperability software, introducing SOLIDWORKS configuration reading, glTF metadata support, and ARM architecture support for the Solid Edge reader. These updates expand the software's ability to handle multi-configuration CAD assemblies and modern 3D web formats. The release targets engineering and manufacturing organizations that rely on cross-platform CAD data exchange across their design and production workflows.

IBM and Arm are collaborating on enterprise AI hardware targeting dual-architecture systems, software virtualization, and data-intensive mission-critical workloads. The partnership combines IBM's enterprise compute infrastructure with Arm's processor architecture, aiming to expand AI deployment options for large-scale industrial and enterprise environments. The collaboration addresses growing demand for flexible, high-throughput AI inference and processing at the infrastructure level.

WACKER has introduced POWERSIL Resin 710, a solvent-free silicone resin compound engineered for heat-resistant molded parts capable of sustained operation above 200°C. The material qualifies for thermal class R components and supports multiple production methods including compression molding, pressure gelation, and injection molding. The solvent-free formulation eliminates VOC-related processing steps that are common in conventional silicone resin systems.

restor3d has launched the Aeros Modular Stem System, an ankle implant that incorporates 3D-printed porous components designed to facilitate osseointegration and fixation. The system is implanted via a standard anterior incision approach. The product represents continued commercial expansion of additive manufacturing in load-bearing orthopedic implant applications.

Hexagon has released an updated version of ESPRIT EDGE, its CAM software for CNC programming, introducing ProPlanAI for automated process planning, expanded guide bushing setup options for Swiss-type turning centers, holder-aware collision detection, and a preview of U-axis turning support. The update targets precision machining environments where toolpath programming complexity directly affects cycle time, scrap rates, and machine utilization. These additions reflect ongoing industry pressure to reduce CAM programming lead times while improving collision avoidance reliability.

LocaXion, which positions itself as the first pure-play RTLS systems integrator, has selected Redpoint's platform as its preferred solution for forklift safety applications in industrial environments. The partnership centers on safety-grade RTLS precision, where the two companies' CEOs discussed the architectural requirements for reliable real-time location data in high-stakes warehouse and manufacturing floor scenarios. The collaboration targets the growing demand for worker-vehicle separation systems that meet industrial safety standards rather than general-purpose location awareness.

Semiconductor Engineering reports on automated multiphysics simulation approaches for 3D integrated circuit design, addressing the coupled thermal, electrical, and mechanical challenges inherent in stacked die architectures. Managing power density, heat dissipation, and structural stress simultaneously is increasingly critical as chipmakers push 3D-IC configurations for advanced packaging. The piece focuses on how simulation toolchains must evolve to handle these interdependencies without manual iteration between disparate solvers.

A metadata injection vulnerability called 'Agent Card Poisoning' has been identified in systems using Google's Agent-to-Agent (A2A) protocol, which enables communication between AI agents. The flaw allows maliciously crafted metadata to redirect sensitive data transmissions to attacker-controlled endpoints. The vulnerability was documented by Semiconductor Engineering, which covers technology relevant to industrial and manufacturing automation systems.

A MACsec (Media Access Control Security) IP core has received ISO/PAS 8800 certification, marking the first such certification for automotive and physical AI security. The standard addresses cybersecurity requirements for road vehicles, and this implementation specifically maintains deterministic timing behavior required for AI-driven control systems. MACsec provides hardware-level encryption at the Ethernet layer without introducing latency variability that would compromise real-time control loops.

NIST researchers have developed a photonic chip packaging technology engineered to survive extreme environments, including deep space and nuclear reactor interiors. The packaging addresses a longstanding barrier to deploying photonic chips in harsh industrial and scientific settings where conventional electronics fail. NIST physicist Nikolai Klimov projects commercial availability within one to two years.

Chemical Engineering's April 2026 bookshelf highlights newly published first-edition technical references relevant to chemical process industries, including 'Fluidization Processes: Design and Operation' by Chew and Cocco (Wiley-VCH, 688 pages, $156) and titles covering ultrasonic water and wastewater treatment. These texts represent current state-of-knowledge in unit operations and environmental compliance for CPI facilities.

Deloitte has published analysis positioning agentic AI as a technology capable of disrupting established manufacturing operations by enabling autonomous decision-making without continuous human input. The technology is characterized as capable of reducing cycle times and reconfiguring worker responsibilities by taking on tasks that currently require human judgment. Unlike conventional automation, agentic AI systems can initiate actions, adapt to changing conditions, and coordinate across multiple process steps independently.

Farsoon has introduced the FS1311M-U, a large-format metal powder bed fusion system featuring 16 lasers capable of build rates up to 1440 cm³/h when processing Ti-6Al-4V at 150 µm layer thickness. The system targets high-throughput metal additive manufacturing applications where build volume and deposition rate have historically constrained production viability. This positions Farsoon as a direct competitor in the industrial-scale metal AM segment currently dominated by EOS, SLM Solutions, and Trumpf.

Parker Hannifin's Motion Systems Group outlines a systems-level electrification strategy for heavy on- and off-road equipment, responding to tightening emissions regulations and advances in battery technology. The article positions electrification not as a single-component swap but as an integrated redesign of drivetrain, hydraulics, and control architecture. The piece reflects broader industry pressure on OEMs and fleet operators to transition away from diesel-dependent powertrains.

Tech Soft 3D has released HOOPS AI, a framework designed to integrate artificial intelligence capabilities into CAD workflows. The toolkit supports dataset preparation, geometric encoding, visualization, and model development, with initial use cases targeting part classification tasks. The release extends Tech Soft 3D's existing HOOPS platform, which is widely used as an underlying SDK in industrial CAD and PLM applications.

HighPoint has introduced the Rocket 1604L, a PCIe Gen5 M.2 expansion card that uses a retimer architecture to support four M.2 NVMe devices simultaneously. The card incorporates MCIO connectivity, lane verification, and real-time power and thermal monitoring capabilities. The retimer design actively regenerates PCIe Gen5 signals, addressing signal integrity challenges inherent at Gen5 speeds of 32 GT/s per lane.

A report from Engineering.com argues that most manufacturers already meet the minimum data infrastructure threshold needed to begin AI implementation, contrary to widespread assumptions about readiness barriers. The key finding is that the digital baseline required to start AI initiatives is lower than most operations teams believe, suggesting that data collection and organization — not technology acquisition — is the primary first step. The report positions data readiness as the foundational prerequisite before any AI tooling is deployed.